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  IDW75E60 power semiconductors 1 rev. 2.1 nov 09 features: ? 600 v emcon technology ? fast recovery ? soft switching ? low reverse recovery charge ? low forward voltage ? 175 c junction operating temperature ? easy paralleling ? pb-free lead plating; rohs compliant ? complete product spectrum and pspice models: http://www.infineon.com/emcon/ applications: ? welding ? motor drives type v rrm i f v f ,tj=25c t j,max marking package IDW75E60 600v 75a 1.65v 175 c d75e60 pg-to-247-3 maximum ratings parameter symbol value unit repetitive peak reverse voltage v rrm 600 v continuous forward current t c = 25 c t c = 90 c t c = 100 c i f 120 82 75 a surge non repetitive forward current t c = 25 c, t p = 10 ms, sine halfwave i fsm 220 a maximum repetitive forward current t c = 25 c, t p limited by t j,max , d = 0.5 i frm 225 a power dissipation t c = 25 c t c = 90 c t c = 100 c p tot 300 170 150 w operating junction and storage temperature t j, t stg -55?+175 c soldering temperature 1.6mm (0.063 in.) from case for 10 s t s 260 c a c pg-to-247-3
IDW75E60 power semiconductors 2 rev. 2.1 nov 09 thermal resistance parameter symbol conditions max. value unit characteristic thermal resistance, junction ? case r thjc 0.5 thermal resistance, junction ? ambient r thja 40 k/w electrical characteristic, at t j = 25 c, unless otherwise specified value parameter symbol conditions min. typ. max. unit static characteristic collector-emitter breakdown voltage v rrm i r =0.25ma 600 - - diode forward voltage v f i f =75a t j =25 c t j =175 c - - 1.65 1.65 2.0 - v reverse leakage current i r v r =600v t j =25 c t j =175 c - - - - 40 1000 a dynamic electrical characteristics diode reverse recovery time t rr - 121 - ns diode reverse recovery charge q rr - 2.4 - c diode peak reverse recovery current i rr - 38.5 - a diode peak rate of fall of reverse recovery current during t b di rr /dt t j =25 c v r =400v, i f =75a, di f /dt =1460a/s - 921 - a/s diode reverse recovery time t rr - 155 - ns diode reverse recovery charge q rrm - 4.4 - c diode peak reverse recovery current i rr - 46.6 - a diode peak rate of fall of reverse recovery current during t b di rr /dt t j =125 c v r =400v, i f =75a, di f /dt =1460a/s - 960 - a/s diode reverse recovery time t rr - 182 - ns diode reverse recovery charge q rrm - 5.8 - c diode peak reverse recovery current i rr - 56.2 - a diode peak rate of fall of reverse recovery current during t b di rr /dt t j =175 c v r =400v, i f =75a, di f /dt =1460a/s - 1013 - a/s
IDW75E60 power semiconductors 3 rev. 2.1 nov 09 p tot , power dissipation 25c 50c 75c 100c 125c 150c 0w 50w 100w 150w 200w 250w 300w i f , forward current 25c 75c 125c 0a 30a 60a 90a 120a t c , case temperature t c , case temperature figure 1. power dissipation as a function of case temperature ( t j 175 c) figure 2. diode forward current as a function of case temperature ( t j 175 c) i f , forward current 0v 1v 2v 0a 50a 100a 150a 200a 175c t j =25c v f , forward voltage 0c 50c 100c 150c 0.0v 0.5v 1.0v 1.5v 2.0v 75a i f =150a 37.5a v f , forward voltage t j , junction temperature figure 3. typical diode forward current as a function of forward voltage figure 4. typical diode forward voltage as a function of junction temperature
IDW75E60 power semiconductors 4 rev. 2.1 nov 09 t rr , reverse recovery time 1000a/s 1500a/s 0ns 50ns 100ns 150ns 200ns t j =25c t j =175c q rr , reverse recovery charge 1000a/s 1500a/s 0c 1c 2c 3c 4c 5c t j =25c t j =175c di f /dt , diode current slope di f /dt , diode current slope figure 5. typical reverse recovery time as a function of diode current slope ( v r =400v, i f =75a, dynamic test circuit in figure e) figure 6. typical reverse recovery charge as a function of diode current slope ( v r = 400v, i f = 75a, dynamic test circuit in figure e) i rr , reverse recovery current 1000a/s 1500a/s 0a 10a 20a 30a 40a 50a 60a t j =25c t j =175c di rr /dt , diode peak rate of fall of reverse recovery current 1000a/s 1500a/s 0a/s -200a/s -400a/s -600a/s -800a/s - 1000a/s - 1200a/s t j =25c t j =175c di f /dt , diode current slope di f /dt , diode current slope figure 7. typical reverse recovery current as a function of diode current slope ( v r = 400v, i f = 75a, dynamic test circuit in figure e) figure 8. typical diode peak rate of fall of reverse recovery current as a function of diode current slope ( v r =400v, i f =75a, dynamic test circuit in figure e)
IDW75E60 power semiconductors 5 rev. 2.1 nov 09 z thjc , transient thermal resistance 1 s10 s 100 s 1ms 10ms 100ms 10 -2 k/w 10 -1 k/w single pulse 0.01 0.02 0.05 0.1 0.2 d =0.5 t p , pulse width figure 9. diode transient thermal impedance as a function of pulse width ( d = t p / t ) r ,(k/w) , (s) 0.0556 0.1495 0.1757 0.02797 0.12374 3.623 e-3 0.12192 3.276 e-4 0.02305 2.635 e-5 c 1 = r 1 r 1 r 2 c 2 = r 2
IDW75E60 power semiconductors 6 rev. 2.1 nov 09
IDW75E60 power semiconductors 7 rev. 2.1 nov 09 published by infineon technologies ag 81726 munich, germany ? 2008 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office (www.infineon.com). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.


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